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Location: Main > Optical Crystals Ceramics > Silicon Carbide Wafers Substrates > SIC-D-N4H-DSP-1000-0350
Name: DIA100.0x0.350mm SiC Wafers(N)-DSP/D-grade
P/N: SIC-D-N4H-DSP-1000-0350
Keywords:Dia100.0x0.35mm,D-grade,N-type 4H,DSP,MOQ25pcs
Unit Price: S$790.00/pc
Available: Call us
Request: Add to Request List
Introduction:
As the 3rd generation semiconductor, silicon carbide possesses wide bandgap, excellent thermal conductivity, high breakdown field strength, saturated electron drift velocity, mechanical hardness and anti-radiation, which are superior to that of conventional semiconductor materials including silicon (Si) and gallium arsenide (GaAs) greatly. Unique properties have hastened SiC to find applications in fabricating high temperature, high frequency, high power and high radiation, and optoelectronic devices during recent years. Besides, small lattice and thermal expansion mismatches with III-group nitride make SiC an outstanding substrate material for the epitaxial growth of nitride films.

Main Applications:
Power electronic devices: Schottky diodes, MOSFET, JFET, BJT, PiN diodes,IGBT etc.
Optoelectronic devices: GaN/SiC LED.

Wafer/Substrate Grade:
D-grade (dummy grade, for research project use)
Material:
 N-type SiC. High-purity single crystal Silicon Carbide
Polytype:
 Single-Crystal 4H
Surface Orientation:
4o toward <11-20>, +/-0.5o
Dopant
N-type (Nitrogen-doped)
Resistivity:
0.028 ~ 0.15 ohm.cm
Outer Diameter:
100.0 +/-0.25mm
Thickness:
 350, +/-25um
Primary-Flat Orientation:
[1-100], +/-5o
Primary-Flat Length:
 32.5, +/-2.0mm
LTV:
<15um(10x10mm area)
TTV:
<20um
Bow:
- 55um to +55um
Wrap:
 </=65um
Front-Surface(Si) Roughness:
 Ra < 0.5nm(RMS)
Micropipe Density:
 </=5 ea/cm2
TSD:
NA
BPD:
NA
Metal Impurities:
NA
Front Surface Stack:
Silicon
Front Surface Finish:
 Si-CMP
Surface Scratch:
NA
Surface Particles:
NA
Indents/Cracks/Stains/Contamination:
NA
Front-Suface Laser Marking:
None
Back Surface Finish:
C-face, polished
Back Surface Scratch:
NA
Back Surface Defects/Chips:
< 2 defects(size of within 1mm)
Back-Surface Roughness:
 Ra < 5nm(RMS)
Packing:
 Packaged in a class 100 cleanroom; 25 pcs Epi-ready Wafer in one multi-wafer cassette; Unless otherwise specified.
MOQ:
 MOQ 25pcs(minimum order quantity); Packing 25pcs/cassette - vacuum packed;